OSD, Fuse, and Rupture Discs: How do the “Safety Trio” on the Battery Cover Perform their Respective Functions?
June 16, 2026

OSD, Fuse, and Rupture Discs: How do the “Safety Trio” on the Battery Cover Perform their Respective Functions?

In the safety system of new energy lithium batteries, thermal runaway prevention is crucial. While cell materials and battery pack protection are well-known, the “safety trio”—OSD, Fuse, and rupture discs—on the square aluminum battery cover creates an immediate, vital barrier for the cell. Each device has a distinct role, and together they intercept risks like

The Key Role of Sealing Aluminum Pins in Batteries
June 9, 2026

The Key Role of Sealing Aluminum Pins in Batteries

New energy power and energy storage batteries contain a small but essential component: the sealing aluminum pins. Hidden in the electrolyte injection hole of the battery cover, this sealing pins is the main barrier for battery sealing, safety, and performance stability. It directly affects the battery’s lifespan and operational safety. What are Sealing Aluminum Pins?

How to Choose a Reliable Manufacturer of Battery Sealing Parts?
June 4, 2026

How to Choose a Reliable Manufacturer of Battery Sealing Parts?

Battery manufacturers face a key challenge with aluminum nails: prototypes meet standards, but in mass production, pressure resistance is unstable, welding leaks occur, production can’t keep up, rework costs rise, deliveries are late, and orders are lost. Despite their small size, battery sealing parts are key for battery safety, preventing leakage after laser-welding seals and

Selection of 5 key parameters for Chip Burn in Test Fixtures
May 26, 2026

Selection of 5 key parameters for Chip Burn in Test Fixtures

Engineers performing chip aging tests know one thing: No matter how well designed the burn-in board is or how precise the temperature control is, a malfunctioning aging test fixture ruins the entire experiment. Intermittent contact problems, probe shrinkage at high temperatures, and chip cracking from cap deformation are common in mass production aging. Most issues

Chip Aging Test Fixture Selection Guide: From Principles to Key Considerations
May 19, 2026

Chip Aging Test Fixture Selection Guide: From Principles to Key Considerations

In the semiconductor industry, it’s said: “A chip untested for aging can’t be trusted for vehicle use.” This refers to chip burn-in testing. The tool used is the chip burn-in test fixture, commonly called a burn-in socket. Many associate it with simply “a socket holding a chip at high temperature,” but engineers experienced in mass

Key Considerations for Battery Manufacturers when Selecting Battery Sealing Aluminum Pins
May 12, 2026

Key Considerations for Battery Manufacturers when Selecting Battery Sealing Aluminum Pins

For battery manufacturers, the key challenge with sealing aluminum pins is that initial performance meets standards during prototyping, but issues arise during mass production—unstable pressure resistance, welding leakage, insufficient production capacity, costly rework, delayed delivery, and even lost orders. The small sealing aluminum pins on battery covers are crucial for safety. After electrolyte injection, laser-welds

How to Choose a Sensor Housing? Plastic vs. Aluminum Alloy vs. Stainless Steel
April 21, 2026

How to Choose a Sensor Housing? Plastic vs. Aluminum Alloy vs. Stainless Steel

The sensor housing is the “first line of defense” protecting the sensor and safeguarding its internal precision components, directly determining the sensor’s stability, lifespan, and applicable scenarios. Choosing the wrong material can lead to signal malfunctions and frequent repairs, or even complete failure of the sensor and increased costs. The mainstream materials for sensor housings

Applications of Chip Packaging and Testing in the Semiconductor Industry
April 14, 2026

Applications of Chip Packaging and Testing in the Semiconductor Industry

Chip Packaging and Testing: A Key Link in the Semiconductor Industry Within the expansive semiconductor industry, chip packaging and testing are critical technical processes. Chip packaging and testing, also referred to as assembly and test, entails enclosing chips produced by wafer fabrication and subjecting them to rigorous performance evaluation, turning them into finished chips ready

Who Can Solve the “Hidden Problems” of Chip Packaging and Testing in the Wave of AI Chips?
April 7, 2026

Who Can Solve the “Hidden Problems” of Chip Packaging and Testing in the Wave of AI Chips?

Packaging and testing are the final steps in the chip manufacturing process. Packaging is responsible for protecting, securing, and electrically connecting the bare chips diced from the wafer, enabling them to communicate with external circuits. Testing, on the other hand, uses a series of electrical performance tests to screen out qualified chips, ensuring the reliability