Plug-and-Play, No Chip Damage.
The COC fishbone fixtures in Burn-in System, with its fishbone array-like design, integrates positioning slots, beryllium copper elastic contact springs, and thermally conductive trenches. It is a key high-value consumable in the production and testing of optical modules, primarily used for burn-in tests of optical chips. Its core function is to provide precise positioning, stable power application, and environmental simulation for the optical chips, ensuring testing accuracy and production line efficiency.
No machine adjustment, no chip damage, no production halt – comprehensive cost reduction, steady increase in yield.
Heju Stamping has 30yrs stamping experience in the design and manufacturing of semiconductor precision stamping parts. As a high-tech enterprise specializing in the R&D, design, and mass production of COC fishbone fixtures in burn-in system, Heju Precision’s self-developed COC fishbone fixture boasts mature technology and stable quality control.
Relying on 8years of mass production experience in supplying beryllium copper spring contacts to Huawei, it features outstanding high-temperature thermal conductivity and clamping performance.
Micron-level precision machining, excellent batch consistency in height and flatness.
Standardized tolerances, complete interchangeability of same model fixtures, immediate use without adjustment.
Precise positioning structure, high repeatability, aviod positional deviation.
The balanced clamping design distributes force evenly, effectively protecting the chip and improving packaging yield.
High thermal conductivity substrate solution, uniform heat conduction, compatible with COC thermal encapsulation process.
Fatigue-resistant elastic components, long-lasting and stable elasticity, extending the service life of the fixtures.
♦ Precise Damage Prevention: Independent elastic springs apply pressure evenly at multiple points, ensuring uniform force distribution and preventing chip deformation, edge chipping, and plating damage;
♦ Process Compatibility: One-stop adaptation for the entire process of wire bonding, room temperature testing, high-temperature aging, and retesting. Automated production lines reduce multiple material transfers and fixture changes;
♦ High-Efficiency Mass Production: Simultaneously adaptable to manual sample production and automated equipment, catering to both small-batch R&D and large-scale mass production needs;
♦ Strong Stability: Wide temperature control adaptation range, less prone to deformation and displacement under high-temperature aging conditions, reducing test data errors;
♦ Wide Versatility: Supports customized adaptation to different sizes of COC and CoS carriers; some customized solutions are compatible with specific TO-type device testing.
♦ Heju use micron-level precision machining: Integrated machining process ensures excellent consistency in height and flatness across batches, guaranteeing process stability from the source.
♦ Heju adopt precision positioning structure ensures accurate and repeatable positioning; balanced and controllable clamping force effectively protects the chip and significantly improves packaging yield.
♦ Heju selects high thermal conductivity substrates and fatigue-resistant elastic components, ensuring long-lasting and stable elasticity, uniform heat conduction, and extending the service life of the fixture.
♦ Heju provides standardized and efficient services. Fixtures of the same model are fully interchangeable, ready to use without debugging; sufficient production capacity reserves and rapid after-sales response minimize downtime losses.
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